Huili FU

About

Dr FU is now working for Alibaba as a VP of Alibaba Group and Senior VP of T-Head (Alibaba subsidiary). Dr FU has more than 30 years’ experience on semiconductor industry. As the IC packaging team founder and the chief expert of Hisilicon (HUAWEI), established and led the team to deliver IC packaging technology and integration solutions for all Hisilicon (HUAWEI) IC projects, pioneering the technologies of Cu-pillar (micro-bump) (Year 2011), PoP (Package-on-package) (year 2011), HBPoP (High-band PoP) (year 2014) and Multi-die Fanout technology and chiplet solution (Year2013). Dr FU led the team to implement the first 16nm FinFET volume IC product and implement the 2.5D interposer IC packaging as the tier1 company in the industry. Dr FU is now working for Alibaba to develop HPC ICs and focus on semiconductor engineering, including chiplet arch, 2.5D/3D integration and Hybrid-bond technologies.

Research Interests